The Reliable Software Developers’ Conference – UK, May 2014

Technology event organiser Energi Technical has announced that it will be launching “The Reliable Software Developers’ Conference”, scheduled for May 2014.

This one-day conference will provide an important forum for engineers and developers working in the development of safety critical systems and high availability systems. It is expected to attract software developers working in such industries as automotive, railway systems, aerospace, bankingmedical and energy. www.rsd-conference.co.uk

“In recent years, software has become so complex that ensuring safety and reliability is now a major challenge,” said Richard Blackburn, Event Organiser. “Many systems now have millions of lines of code and will handle enormous amounts of data. Further to this, modern computer based systems will make millions of decisions every second and also have to be immune to interference and unpredictable events. This event will look at the MISRA coding standards, debug tools and software testing tools that are available to assist software programmers and engineers seeking to develop reliable and safety critical
systems.”

The Reliable Software Developers’ Conference will be co-located with the 2014 UK Device Developers’ Conference. Both will be a one-day conference to be run in Bristol, Cambridge, Northern England and Scotland on May 20th, May 20rd, June 3rd and June 5th.

Delegates attending either event will have the opportunity to sit in on technical presentations and ½ day technical workshops and a attend a vendor exhibition of tools and technology for the development of real-time and embedded systems. www.device-developer-conference.co.uk

“Advanced Debug Tools, Code Test, Version Control, Verification Tools and Software Standards have been a growing feature of recent conferences, so it made sense to create a dedicated event,” said Richard. “There will be a lot expertise available to delegates, and the chance to meet a broad range of vendors of test technologies and tools, all under one roof.”

Developed in collaboration with MISRA (Coding Standards), the Reliable Software Developers’ Conference will feature a number of presentations in the morning, followed by a half-day technical workshop in the afternoon. The presentations will be free and open to delegates of both Conferences, but the half-day workshops will be subject to a charge of £75. Delegates will learn about developments in coding standards, test and verification tools and best practices and it will also be an opportunity to meet with many industry experts.

Refer to:http://embedded-computing.com/news/the-uk-may-2014/

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Comprehensive customization for network appliances: meet our rackmount and micro box!

acrosser Technology, a world-leading network communication designer and manufacturer, introduces two network appliances that deliver great performance and protection while simplifying your network. Each product has its own target market and appeals to a unique audience.

Acrosser’s ANR-IB75N1/A/B serves as an integrated Unified Threat Management (UTM) device that covers all of your networking security needs. Featuring a 3rd generation Intel Core i processor, increased processing throughput is easily made. For integration with information security systems, the device also features functions such as anti-virus, anti-spam, fire wall, intrusion detection, VPN and web filtering, in order to provide complete solutions to meet the demands of various applications.

Key features of the ANR-IB75N1/A/B include:
‧Support for LGA1155 Intel® Core ™ i7/i5/i3 processor / Pentium CPU
‧Intel B75 Chipset
‧2 x DDRIII DIMM, up to 16GB memory.
‧2 x Intel 82576EB Fiber ports
‧8 x Intel 82574L 10/100/1000Mbps ports
‧Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4)
‧LAN bypass can be controlled by BIOS and Jumper
‧CF socket, 2 x 2.5” HDD, 1 x SATA III, 1 x SATA II
‧Console, VGA (pinhead), 2 x USB 3.0 (2 x external)
‧Support boot from LAN, console redirection
‧Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment
‧LCM module to provide user-friendly interface
‧Standard 1U rackmount size

As for our micro box, the AND-D525N2 provides more possibilities for different applications due to its small form factor (234mm*165mm*44mm). Aside from its space-saving design, the other 3 major features of the AND-D525N2 are its high performance, low power consumption and competitive price. Please send us your inquiry via our website (http://www.acrosser.com/inquiry.html), or simply contact your nearest local sales location for further information.

Key features of the AND-D525N2 include:
‧Intel Atom D525 1.86GHz
‧Intel ICH8M Chipset
‧x DDR3 SO-DIMM up to 4GB
‧1 x 2.5 inch HDD Bay, 1 x CF socket
‧4 x GbE LAN, Realtek 8111E
‧2 x USB2.0
‧2 x SATA II
‧1 x Console
‧1 x MiniPCIe socket

Besides In addition to these two models, Acrosser also provides a wide selection of network security hardware. With more than 26 years of rich industry experience, Acrosser has the ODM/OEM ability to carry out customized solutions, shortening customers’ time-to-market and creating numerous profits.

For all networking appliances product, please visit:
http://www.acrosser.com/Products/Networking-Appliance.html

Product Information – ANR-IB75N1/A/B:
http://www.acrosser.com/Products/Networking-Appliance/Rackmount/ANR-IB75N1/A/B/Networking-Appliance-ANR-IB75N1/A/B.html

Product Information – AND-D525N2:
http://www.acrosser.com/Products/Networking-Appliance/MicroBox/AND-D525N2/ATOM-D525-AND-D525N2.html

Contact us:
http://www.acrosser.com/inquiry.html

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INDUSTRIAL ETHERNET GROWING IN CHINA

However, the growing speed of Ethernet is quite considerable in China and we think it is a great opportunity for Chinese customers to upgrade their automation system under current market condition. Customers will just jump from old Fieldbus Technologies direct to Ethernet now and actually many of them are doing right now. The Chinese market is currently engaged in extensive upgrading and new infrastructure construction, and that will require a great deal of Ethernet applications.

In China, international brands are quite influential. This is also true for industrial networking protocols because most of them having their supporting companies. For example, the most popular Fieldbus protocols in China are PROFIBUS and CC-Link, which are developed and promoted by Siemens and Mitsubishi separately, which command large market share in China.

refer to:http://www.automation.com/portals/industrial-networks-field-buses/industrial-ethernet-growing-in-china

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High Computing Performance for All Applications- F.I.T. Technology

The demand for computing performance in the IPC market continues to become stronger as the IT field advances. acrosser’s new AES-HM76Z1FL has been designed to meet these demands.
The F.I.T. Technology used to build this new product reflects its 3 major features: fanless design, Intel core i processor and ultra thin frame. The fanless design not only reduces the risk of exposure to air dust, but also prevents fan-malfunction. With a height of less than 0.8 inches, AES-HM76Z1FL’s slim design makes itself FIT into every application.
As its structure and output interface show, AES-HM76Z1FL provides a wide range of choices, from HDMI, VGA, USB, and audio to GPIO output interfaces that suit almost all industries. For wireless communication needs, the AES-HM76Z1FL has a mini-PCle expansion slot which provides support on both 3.5G and WiFi.
Another fascinating feature of the AES-HM76Z1FL is its ease of installation for expansions. By disassembling the bottom cover, expansions such as CF cards, memory upgrades and mini-PCIe can be easily complete without moving the heat sink. Moreover, Acrosser adopts 4 types of CPU (Intel Core i7/i3, Intel Celeron 1047UE/927UE) for AES-HM76Z1FL, allowing it to satisfy the scalable market demands of different applications.
In conclusion, the AES-HM76Z1FL is truly a well-rounded product designed for diverse applications. To promote our star product AES-HM76Z1FL, Acrosser will launch a product testing campaign starting in January, 2014. Acrosser will provide selected applications with the new AES-HM76Z1FL for one month, and it’s free! For more detailed information, please stay tuned for our press release, or leave us an inquiry on our website at www.acrosser.com!Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html
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Innovation Automation Vendors Serve Products & Services

Over the last few years a number of automation vendors have announced various services including outsourced maintenance, system integration, manufacturing and business process consulting, and remote operations. I wonder if an automation vendor can continue to be effective as both a product company and services provider.

To clarify the difference, let’s start by defining what I mean by services and products. By providing services, automation vendors engage with customers to perform labor and knowledge intensive tasks that may include system design, engineering services, system integration, preventative maintenance, remote operations, and other services. By providing products, automation vendors sell something to the customers, system integrators and engineering firms that they will apply to accomplish automation tasks in manufacturing and process environments.

Service Dynamics

The primary objective of a service company should be to focus on the development a system solution that is uniquely suited to the idiosyncrasies of the client’s business without being tethered by particular product solution offerings. A big part of this is the ability to deploy technologies from appropriate sources using integration and engineering skills to achieve a superior result for the client. Service businesses need to have effective and refined project, personnel, and quality management systems. The growth and effectiveness of these businesses is directly related to adding and managing smart people and this is a unique business proficiency mastered by successful service organizations. Pure service businesses have an advantage of successfully maintaining alliances with a range of product vendors that cannot be logically achieved by product vendors who provide services. This separation positions a pure service business to use best of breed and get the most out of vendors. For comparison, consider you are a smartphone user and the only place to get apps was your phone hardware vendor.

refer to:http://www.automation.com/portals/factory-discrete-automation/can-automation-vendors-serve-two-masters-products-services

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Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

acrosser Technology Co. Ltd, a world-leading industrial and embedded computer designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-HM76Z1FL, acrosser’s latest industrial endeavor, is surely a FIT under multiple circumstances. Innovation can be seen in the new ultra slim fanless design, and its Intel core i CPU can surely cater for those seeking for high performance. Therefore, these 3 stunning elements can be condensed as “F.I.T. Technology.” (Fanless, Intel core i, ultra Thin)

The heat sink from the fanless design provides AES-HM76Z1FL with great thermal performance, as well as increases the efficiency of usable space. The fanless design provides dustproof protection, and saving the product itself from fan malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20 millimeters (272 mm x183 mm x 20 mm). This differs from most embedded appliances, which have a height of more than 50 millimeters.

The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4 x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or WiFi module.

Different from most industrial products that focus on application in one specific industry, the AES-HM76Z1FL provides solutions for various applications through the complete I/O interfaces. Applications of the AES-HM76Z1FL include: embedded system solutions, control systems, digital signage, POS, Kiosk, ATM, banking, home automation, and so on. It can support industrial automation and commercial bases under multiple circumstances.

Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3/i7-AES-HM76Z1FL.html

Contact us:
http://www.acrosser.com/inquiry.html

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Rugged COM Express: Empowering high-performance automation for an increasingly connected world

What’s needed is a modular embedded computing architecture that addresses these cost and downtime issues. Perhaps the most compelling of the modular architectures available today is COM Express. COM Express provides the requisite computing power for today’s increasingly connected world while also extending the lifespan of the underlying system. As chip technology evolves, users can switch out the module without adverse effect on the underlying hardware and assets – saving time and money. The modularity, simplicity, and reliability of COM Express technology help businesses remain competitive, profitable, and flexible.

Leveraging upgrades in processing power

COM Express-based technology was developed in 1994 by PICMG, a 250-company consortium that develops open specifications for high-performance computing applications. Today, the COM Express form factor comes in four sizes:

Mini: 55 x 84 mm
Compact: 95 x 95 mm
Basic: 95 x 125 mm
Extended: 110 x 155 mm
These different sizes of COM Express modules help businesses to remain competitive by maximizing the performance of critical infrastructure systems in an increasingly connected world in any conceivable industrial application.

The need for improved performance is evidenced by continuous new product introductions by processor manufacturers such as Intel, AMD, and others. Whether it is better threading, more cores, better graphics, lower power, or higher clock speeds, these companies continuously respond to demand for more and faster computing across the board – whether on the desktop or in embedded industrial systems. But replacing a complete subassembly or subsystem each time a compelling new generation of technology becomes available is time-consuming, expensive, and risky. And yet the need to leverage greater levels of processor power and performance is an imperative. Separating the processor module from the underlying carrier means that technology upgrade is painless and affordable.
refer to:http://industrial-embedded.com/articles/rugged-increasingly-connected-world/

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new standards using model-based design


With the FAA and EASA adopting aviation standards such as DO-178C and ARP4754A, UAV software developers should familiarize themselves with these standards, particularly when transitioning to model-based design.

Few applications place more importance on verification, or prescribe more process guidance, than aviation. The FAA and its European equivalent, EASA, provide guidance using standards such as ARP4754 for aircraft systems and DO-178B for flight software. These standards are often used outside of civil aviation, in whole or in part, for applications including military aircraft and land vehicles. Adoption for UAV programs is rapidly growing because of the FAA’s recent decision to require UAS and OPA certification via FAA Order 8130.34A. UAV systems are heterogeneous, and not restricted just to flight software. Therefore, other standards are used such as DO-254 for hardware and DO-278 for ground and space software.

With model-based design, UAV engineers develop and simulate system models comprised of hardware and software using block diagrams and state charts, as shown in Figures 1 and 2. They then automatically generate, deploy, and verify code on their embedded systems. With textual computation languages and block diagram model tools, one can generate code in C, C++, Verilog, and VHDL languages, enabling implementation on MCU, DSP[], FPGA[], and ASIC hardware. This lets system, software, and hardware engineers collaborate using the same tools and environment to develop, implement, and verify systems. Given their auto-nomous nature, UAV systems heavily employ closed-loop controls, making system modeling and closed-loop simulation, as shown in Figures 1 and 2, a natural fit.

ARP4754A addresses the complete aircraft development cycle from requirements to integration through verification for three levels of abstraction: aircraft, systems, and item. An item is defined as a hardware or software element having bounded and well defined interfaces. According to the standard, aircraft requirements are allocated to system requirements, which are then allocated to item requirements.

The fact that ARP4754A addresses allocation of system requirements to hardware and software components is significant to UAV developers, especially suppliers. Some suppliers might have claimed that UAV subsystem development was beyond the scope of the original ARP4754, even for complex subsystems containing hardware and software, but not anymore. ARP4754A also more clearly refers to DO-178 and DO-254 for item design. In fact, the introductory notes for ARP4754A acknowledge that its working groups coordinated with RTCA special committees to ensure that the terminology and approach being used are consistent with those being developed for the DO-178B update [DO-178C].

Given the high coupling among systems, hardware, and software for UAVs, it is helpful that the governing standards now clarify relationships between systems and hardware/software subsystems.

ARP4754A recommends the use of modeling and simulation for several process-integral activities involving requirements capture and requirements validation.

ARP4754A Table 6 recommends (R) analysis, modeling and simulation (tests) for validating requirements at the highest Development Assurance Levels (A and B). For Level C, modeling is listed as one of several recommendations. While ARP4754 made similar recommendations, ARP4754A provides more insight and states that a representative environment model, such as the plant model shown in Figure 1, is an essential part of a system model.

Also noted in ARP4754A is that a graphical representation or model can be used to capture system requirements. The standard now notes that a model can be reused for software and hardware design.

If engineers use models to capture requirements, ARP4754A recommends engineers consider the following:

1. Identify the use of models/modeling

2. Identify the intended tools and their usage during development

3. Define modeling standards and libraries

When using model-based design with ARP4754A and DO-178C, additional verification capabilities are often needed beyond in-the-loop testing described in Table 2. These including requirement tracing, model standard checking, model-to-code structural equivalence checking, and robustness analysis using formal methods. For UAVs, rigorous verification that includes multiple verification technologies is paramount given their autonomous nature and system complexity.

DO-178C

Not surprisingly, one of the first changes new in DO-178C is an explicit mention of ARP4754A in Section 2: System life-cycle processes can be found in other industry documents (for example, SAE ARP4754A).

Clarification updates aside, such as the one noted earlier, DO-178C does not differ significantly from DO-178B, at least at first glance. In fact, a casual reader might miss an item mentioned in Section 1.4: How to Use this Document: One or more supplements to this document exist and extend the guidance in this document to a specific technique… if a supplement exists for a specific technique, the supplement should be used …

In other words, the standard’s big changes are captured in the supplemental documents, such as RTCA DO-331, Model-Based Development and Verification Supplement to DO-178C and DO-278A.

Pertinent to this discussion, a long-standing issue with DO-178B for practitioners of model-based design is the uncertainty in mapping DO-178B objectives to model-based design artifacts. Addressing this mapping was a main goal of the DO-178C Sub-Group (SG-4) focused on model-based design. No single mapping sufficed, so several mappings are provided in DO-331. Some include the concept of a Specification model, which is a model separate from that of the one used for design and code generation. The other concept is a Design model, which serves as the detailed requirements used to generate code.

refer to:
http://mil-embedded.com/articles/transitioning-do-178c-arp4754a-uav-using-model-based-design/

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Asia claims almost half of Industrial automation computer sales

A recent report by IHS has shown that in 2012, capital expenditure on industrial automation equipment in Asia reached a total of $76.6bn, representing 46% of global investments in the sector.

Despite this established and rising trend, selling industrial automation equipment in Asia remains a clear business opportunity and one where many European providers are lagging behind.

Despite the first half of 2012 seeing an Asian market slowdown, with only a 3.7% growth in overall revenue from industrial automation equipment, the second half of the year showed definite improvement. The positive trend has continued in 2013, with the industrial automation sector set to grow by 6.2%. In such a dynamic market, getting new business can be both a business and technical challenge.

One of the key areas of opportunity is the power industry, where the booming consumer and industrial power markets in developing economies such as China and India have created rocketing demand. In China the per capita energy use is still a long way behind most of Western Europe, meaning the potential for growth is still huge. Without question, Asia represents a perfect storm of opportunities for European automation suppliers.

In order to help businesses better understand how to take advantage of the current climate and increase their industrial automation sales in Asia, particularly China, the CC-Link Partner Association (CLPA) is hosting a seminar entitled ‘Gateway to China’. The event will take place on 24th September at the Mitsubishi Electric Europe Tokyo Conference Suite in Hatfield.

For more information on the speakers and to book tickets for the event, visit the CLPA’s EventBrite page gateway-to-china.eventbrite.co.uk/.

In light of the sensitive current economic climate, many Asian companies are taking a more careful approach to investment – they are becoming more demanding towards their suppliers and making more enquiries before purchasing. Furthermore, according to IHS’ research, several Chinese manufacturers are currently developing products which are in direct competition with the ones provided by Western suppliers of industrial automation solutions. These are only a few of the obstacles facing European vendors who want to penetrate the Asian market to change the way they do business.

Flexibility and the ability to respond to very specific demands are becoming essential factors when dealing with the Asian market. Being able to offer technologies and products which are compatible with the needs of Asian clients is no longer an option, it’s a must.

– See more at: http://www.connectingindustry.com/automation/asia-claims-almost-half-of-automation-sales.aspx#sthash.4z4uCkA2.dpuf

refer to:http://www.connectingindustry.com/automation/asia-claims-almost-half-of-automation-sales.aspx

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What You Need To Know Affect Your Salary

Based on the survey results, this job satisfaction is tied to a number of factors. While salary is a leading factor, it is not the only factor. Like previous years, the feeling of accomplishment rated the highest, with solutions challenge, benefits, salary, pleasant work environment, good relationship with work colleagues, and job security also contributing factors. The top four most important benefits are health insurance (63.6%), pension plan/401K (47.7%), flexible working hours (40.5%), and paid time off (33.2%).

Again this year, we asked respondents to tell us if they were currently seeking new job opportunities. Those who are actively seeking new opportunities made up 8.0% of respondents and had an average annual salary of $98,166—about $8,000 less than the average. Passive job seekers made up 36.9% of respondents, whose average salary was slightly less than average at $104,103. Those not seeking new opportunities (55.1%) were making an above average salary of $109,809.

There is a message here for employers. If you are paying less than the industry average, you could very likely lose your engineers. Based on data from automation techies, a recruiting and contract staffing company based in Minnesota, there is a high demand for automation professionals, and high-quality candidates are hard to find. When companies do find good candidates, the candidates typically have multiple offers on the table. If your company employs high-quality professionals, pay them well, or you may lose them.

refer to:http://www.automation.com/factors-that-affect-your-salary-what-you-need-to-know

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