Daily Archives: July 15, 2013

New regulation standards and form factors for embedded industry

To help embedded computer and OEMs meet extreme requirements for vibration, temperature, or other harsh environmental conditions, memory suppliers offer manufacturing advancements such as side retainer clips to ruggedize DDR3 SODIMM modules. These universally adaptable clips can be easily implemented … Continue reading

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Reducing DDR3 VLP life cycle

Reducing the height of a DDR3 VLP embedded computer memory module to a lower-profile 17.78 mm solves the space-constrained limitations found in many telecom and networking applications, where it is difficult to accommodate the memory required for both an industry-standard … Continue reading

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