Reducing DDR3 VLP life cycle

Reducing the height of a DDR3 VLP embedded computer memory module to a lower-profile 17.78 mm solves the space-constrained limitations found in many telecom and networking applications, where it is difficult to accommodate the memory required for both an industry-standard DIMM or Mini DIMM socket plus a standard VLP. and networking blade systems typically face strict limitations on system height. In addition, these systems require spacing on top of the memory module to enable airflow for effective thermal management. Incorporating a reduced height DDR3L VLP memory module helps improve airflow and provides a low profile, allowing OEMs to offer higher-reliability products that reduce total cost of ownership. Specific DDR3L VLP modules also offer single refresh rates, which are now essential to embedded computer maximize performance in high-temperature systems.

refer to: http://embedded-computing.com/articles/ruggedization-memory-module-design/

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