Monthly Archives: July 2013

Making of 4th generation Intel® Core™ processors

Posted on July 29, 2013 by admin

This whitepaper gives engineers a closer look into the architectural improvements of the new microarchitecture and delivers the answers as to how they can integrate these most efficiently into their appliances.The 4th generation Intel® Core™ processors serve the embedded computing space with … Continue reading →

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Announcements for embedded computer

Posted on July 22, 2013 by admin

“Qseven was defined from scratch for mobile and embedded computer carries no old legacy interfaces,” Eder continues. “The maximum power consumption for Qseven is defined at 12 W – the first definition for COM Express defined a 188 W maximum … Continue reading →

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New regulation standards and form factors for embedded industry

Posted on July 15, 2013 by admin

To help embedded computer and OEMs meet extreme requirements for vibration, temperature, or other harsh environmental conditions, memory suppliers offer manufacturing advancements such as side retainer clips to ruggedize DDR3 SODIMM modules. These universally adaptable clips can be easily implemented … Continue reading →

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Reducing DDR3 VLP life cycle

Posted on July 15, 2013 by admin

Reducing the height of a DDR3 VLP embedded computer memory module to a lower-profile 17.78 mm solves the space-constrained limitations found in many telecom and networking applications, where it is difficult to accommodate the memory required for both an industry-standard … Continue reading →

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Contemporary embedded computer market

Posted on July 1, 2013 by admin

  The nowadays market provides a wide range of densities of its embedded computer memory card, 4 GB to 64 GB, with an integrated 16-bit NAND controller that offers more robust management and memory optimization compared to discrete NAND devices. … Continue reading →

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